Bonding structure of device packaging
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United States of America Patent
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Jul 3, 2007
Grant Date -
Apr 13, 2006
app pub date -
Feb 2, 2005
filing date -
Oct 11, 2004
priority date (Note) -
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Abstract
A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The first bonding layer is combined with the second bonding layer, and the metal pads are in electrical communications with the electrodes. The second substrate may be a flexible substrate to decrease the strain between the first substrate and the second substrate.
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