Conductive path structure and wire harness

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9230713
APP PUB NO 20130153292A1
SERIAL NO

13819506

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and an insulation member that covers the cut-off facilitating portion directly or indirectly. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the insulation member is configured so as to cover the separated first conductive portion and the separated second conductive portion.

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First Claim

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Patent Owner(s)

  • YAZAKI CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adachi, Hideomi Kosai, JP 114 598
Kuboshima, Hidehiko Kosai, JP 82 1061
Ozaki, Yoshiaki Kosai, JP 44 363

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