Marking system and laser cutting machine

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11413707
APP PUB NO 20200114470A1
SERIAL NO

16597739

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A marking system configured for marking a metallic workpiece is provided. The marking system includes an interface configured to receive information about parts to be cut out of the workpiece. A marking unit is movable over a processing area configured to receive the workpiece. The marking unit is configured to provide parts to be cut with a marking identifying the respective part to be cut before the cutting process from the workpiece.

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First Claim

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Patent Owner(s)

  • BYSTRONIC LASER AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imboden, Ernest Steinhof, CH 4 7
Rychard, Christoph Wynigen, CH 1 0

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