Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure

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United States of America Patent

PATENT NO 11674040
APP PUB NO 20200239758A1
SERIAL NO

16633452

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Abstract

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Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.

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Patent Owner(s)

Patent OwnerAddress
DOW TORAY CO LTD2-24 HIGASHI-SHINAGAWA 2-CHOME SHINAGAWA-KU TOKYO 140-8617

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ota, Kenji Ichihara, JP 45 296

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