Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device

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United States of America Patent

PATENT NO 8593812
APP PUB NO 20120014066A1
SERIAL NO

13259370

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged.

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Patent Owner(s)

  • TOYOTA JIDOSHA KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kakiuchi, Eisaku Toyota, JP 10 149
Morino, Masahiro Okazaki, JP 8 97
Takano, Yuya Nishio, JP 16 191
Taketsuna, Yasuji Okazaki, JP 32 649

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