Method for manufacturing semiconductor devices having a glass substrate
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United States of America Patent
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Oct 1, 2013
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app pub date -
Jun 13, 2012
filing date -
Jul 15, 2010
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Abstract
A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer.
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