Redistribution structure for integrated circuit package and method of forming same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11444034
APP PUB NO 20210358854A1
SERIAL NO

17015370

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Abstract

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A redistribution structure for a semiconductor device and a method of forming the same are provided. The semiconductor device includes a die encapsulated by an encapsulant, the die including a pad, and a connector electrically connected to the pad. The semiconductor device further includes a first via in physical contact with the connector. The first via is laterally offset from the connector by a first non-zero distance in a first direction. The first via has a tapered sidewall.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Li-Hsien Zhubei, TW 113 1121
Su, An-Jhih Taoyuan, TW 190 1857
Yeh, Der-Chyang Hsinchu, TW 264 8178
Yeh, Ming Shih Zhubei, TW 29 146
Yu, Chen-Hua Hsinchu, TW 2036 41015

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