Programmable multi-chip module
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United States of America Patent
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Aug 22, 2006
Grant Date -
N/A
app pub date -
Jul 21, 2003
filing date -
Jul 21, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-chip module comprising: a first IC having a first column of tiles, where each tile includes programmable logic; a second IC having a second column of tiles, where the second column is aligned with the first column; and a carrier die having signal lines, where a tile in the first column is directly connected to a tile in the second column via one of the signal lines.
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