LED package and method of assembling the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8497560
APP PUB NO 20100148206A1
SERIAL NO

12714371

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

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Patent Owner(s)

  • INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Ming-Te Taipei County, TW 88 767
Lin, Ming-Yao Taipei County, TW 51 338
Tai, Kuang-Yu Hsinchy, TW 16 218

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