Panel, semiconductor device and method for the production thereof
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United States of America Patent
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Aug 10, 2010
Grant Date -
Aug 14, 2008
app pub date -
Feb 22, 2007
filing date -
Feb 9, 2007
priority date (Note) -
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Abstract
A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components.
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