Semiconductor device package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11764179
SERIAL NO

16994483

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Abstract

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The present disclosure provides a semiconductor device package. The semiconductor device package includes a conductive pillar having a first surface, a second surface, and a lateral surface extending between the first surface and the second surface. The lateral surface has a first part and a second part connected to the first part. The semiconductor device package also includes a barrier layer in contact with the first part of the lateral surface of the conductive pillar and an encapsulant in contact with the second part of the lateral surface of the conductive pillar. The semiconductor device package also includes a first flowable conductive material disposed on the first surface of the conductive pillar. A method of manufacturing a semiconductor device package is also disclosed.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Zhi-Yuan Kaohsiung, TW 3 0

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