Laterally unconfined structure
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United States of America Patent
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Aug 22, 2023
Grant Date -
Nov 25, 2021
app pub date -
May 7, 2021
filing date -
May 19, 2020
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Techniques are employed to mitigate the anchoring effects of cavity sidewall adhesion on an embedded conductive interconnect structure, and to allow a lower annealing temperature to be used to join opposing conductive interconnect structures. A vertical gap may be disposed between the conductive material of an embedded interconnect structure and the sidewall of the cavity to laterally unpin the conductive structure and allow uniaxial expansion of the conductive material. Additionally or alternatively, one or more vertical gaps may be disposed within the bonding layer, near the embedded interconnect structure to laterally unpin the conductive structure and allow uniaxial expansion of the conductive material.
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