Printed substrate through which very strong currents can pass and corresponding production method
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United States of America Patent
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Sep 3, 2013
Grant Date -
Feb 4, 2010
app pub date -
Nov 13, 2007
filing date -
Nov 14, 2006
priority date (Note) -
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Abstract
On a printed circuit or substrate board (10) designed to receive electronic components and having conductive tracks (12) printed on said board, one or more conductive bars (18) are provided that are mounted one after another between conductive link surfaces (140, 142, 144), the conductive bars (18) being electrically interconnected during a subsequent soldering process that is either a wave soldering process or a soldering process in a reflow oven.
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