Multi-chip package for reducing test time
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United States of America Patent
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Aug 4, 2009
Grant Date -
Jul 13, 2006
app pub date -
Jan 6, 2006
filing date -
Jan 7, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multi-chip package is provided. The multi-chip package includes semiconductor chips. The multi-chip package receives selection signals for selecting two or more chips in response to the selection signals. Any number of chips may be simultaneously selected for a test and the test time can be reduced.
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