Ribbon bonding in an electronic package
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United States of America Patent
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Jun 29, 2010
Issued Date -
N/A
app pub date -
Feb 15, 2007
filing date -
May 2, 2003
priority date (Note) -
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Abstract
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
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