Semiconductor package and method for manufacturing semiconductor package
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United States of America Patent
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Jun 21, 2011
Grant Date -
Dec 24, 2009
app pub date -
Oct 2, 2007
filing date -
Oct 5, 2006
priority date (Note) -
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Abstract
A semiconductor package of this invention includes external electrode pad 5 which is formed by a conductive member that is made either of conductive resin or conductive ink, which is connected to an internal circuit of a semiconductor device, and which is to be electrically connected to an external portion, plating layer 6 which is provided on an entire surface of external electrode pad 5, and insulating resin layer 7 which covers plating layer 6 on a peripheral edge of external electrode pad 5, and which exposes a portion of plating layer 6 on external electrode pad 5.
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