Manufacturing method of semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 18, 2008
Grant Date -
Dec 1, 2005
app pub date -
May 24, 2005
filing date -
May 26, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate; (b) setting up a soldering material above the electrical connection part so as to be in contact with the paste; and (c) forming an external terminal from the soldering material and forming a reinforcement from the paste by fusing the soldering material and the paste. The reinforcement exposes part of the external terminal and covers a periphery of an edge of a base connected to the electrical connection part of the external terminal.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully