Thermal dissipation substrate
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United States of America Patent
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Aug 5, 2014
Grant Date -
Nov 1, 2012
app pub date -
Jul 13, 2012
filing date -
Apr 13, 2012
priority date (Note) -
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Abstract
The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.
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