Forming a hybrid device
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United States of America Patent
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Apr 6, 2010
Grant Date -
Sep 27, 2007
app pub date -
Mar 27, 2006
filing date -
Mar 27, 2006
priority date (Note) -
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Abstract
In one embodiment, the present invention includes a hybrid device having a first die including a semiconductor device and a second die coupled to the first die, where the second die includes a magnetic structure. The first die may be a semiconductor substrate, while the second die may be a magnetic substrate, and the first die may be stacked on the second die, in one embodiment. Other embodiments are described and claimed.
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