Electronic component heat sink attachment using a canted coil spring
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United States of America Patent
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-
Mar 28, 1995
Grant Date -
N/A
app pub date -
May 21, 1993
filing date -
May 21, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thermal attachment assembly for heat generating electronic devices which uses a canted coil spring to apply pressure directly against electronic components. The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against a surface of a shoulder or side wall of the heat sink housing. The force of the canted coil spring can be counterbalanced by a cover for the housing, or by an abutment that is either fixed in the housing or floats between attachment and an assembly at each of opposite sides of the housing.
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