Substrate structures and methods of manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11419217
APP PUB NO 20180132358A1
SERIAL NO

15868747

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Abstract

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A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

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Patent Owner(s)

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Yusheng Phoenix, US 92 117
Takakusaki, Sadamichi Ota, JP 29 228

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