Apparatus for melting a solder by vapor-phase treatment
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United States of America Patent
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Jul 26, 1988
Grant Date -
N/A
app pub date -
Mar 9, 1987
filing date -
Jun 13, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Apparatus for melting by vapor-phase treatment a solder applied to an object. The liquid serving for vapor production, which is situated in a vessel, is heated by electrical heating means which are disposed exclusively outside of the vessel and are completely enveloped by a liquid heat-carrying medium. The vessel floor is provided with projections to increase the thermal transfer. A tubing coil is furthermore disposed in the heat-carrying medium for rapid cooling thereof.
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