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Abstract

The present invention is a hybrid integrated circuit comprising at least two semiconductor dies. A high performance semiconductor die includes high performance epitaxy layers grown on a donor substrate, which may form active devices such as transistors. A supporting semiconductor die includes epitaxy layers of a commercially available technology and grown on a native substrate to form passive devices such as resistors, capacitors, inductors, backside via holes, or active devices such as transistors The semiconductor dies are attached to a metallic mounting structure and may be electrically interconnected using traditional IC interconnect methods, such as wire bonding. The metallic mounting structure may function as a grounding base, which may be formed of electrically conductive metal such as copper. The high performance epitaxy layers may include GaN epitaxy layers, AlGaN epitaxy layers, SiC epitaxy layers, or a combination of the three.

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First Claim