Semiconductor package with a heat spreader
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United States of America Patent
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-
Mar 7, 2006
Grant Date -
Aug 12, 2004
app pub date -
Dec 30, 2003
filing date -
Dec 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor package capable of spreading heat includes an upper PCB and a lower PCB connected to a first chip and a second chip by using gold bumps, respectively. Also the semiconductor package includes a heat spreader and thermally conductive members. The heat spreader spreads the heat generated by the first chip and the second chip. The thermally conductive members transmit the heat to the heat spreader by connecting the heat spreader to the first chip and the second chip with the thermally conductive members.
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