Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
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United States of America Patent
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Sep 25, 2007
Grant Date -
Aug 11, 2005
app pub date -
Nov 30, 2004
filing date -
Apr 30, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat-support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.
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