Semiconductor packages and methods of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11545438
APP PUB NO 20210202389A1
SERIAL NO

17090899

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Abstract

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A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Sao-Ling Hsinchu, TW 40 471
Hsieh, Cheng-Yen Hsinchu, TW 4 4
Huang, Ping-Kang Chiayi, TW 22 380
Wang, Yi-Jhang Hsinchu, TW 2 2
Yu, Chun-Hui Hsinchu County, TW 48 512

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