Electrical interconnection apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 7, 1980
Grant Date -
N/A
app pub date -
Jul 30, 1979
filing date -
Jul 30, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrical interconnection apparatus for mounting integrated circuit modules and for adapting the terminal pattern of the densely spaced leads of a module to the terminal pattern of the more widely spaced pin sockets of a printed wiring board. Rows of terminals (19, 20), spaced to conform to the module leads, are arranged on two sides of a module support platform (10) and are extended by conducting elements (27, 28, 29, 30) to particular terminal pins of a plurality of rows of terminal pins (21, 22, 23, 24, 25, 26) extending from the underside of lead frame blocks (11, 12) retained by the support platform (10). Ground plane elements (15, 16, 17, 18) are featured which are supported by the lead frame blocks (11, 12) between the terminal pin rows (21, 22, 23, 24, 25, 26) to control the impedance of the conducting elements (27, 28, 29, 30).
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Cited Art Landscape
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