Inductive devices and methods of forming inductive devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11476043
APP PUB NO 20210202165A1
SERIAL NO

16729545

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An inductive device may be provided, including a substrate and an inductive structure arranged over the substrate. The inductive structure may include a bottom metal winding layer; a top metal winding layer arranged further away from the substrate than the bottom metal winding layer; a magnetic core layer arranged between the bottom metal winding layer and the top metal winding layer; a connector arranged to electrically connect the bottom metal winding layer and the top metal winding layer; and a top metal ring element arranged around the top metal winding layer, spaced apart from the top metal winding layer. The inductive device may further include a guard ring element arranged under the top metal ring element and around the magnetic core layer, spaced apart from the magnetic core layer; wherein the guard ring element may include a magnetic material.

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Patent Owner(s)

  • GLOBALFOUNDRIES SINGAPORE PTE. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chor Shu Singapore, SG 11 10
Peng, Lulu Singapore, SG 15 40
Susai, Lawrence Selvaraj Singapore, SG 12 3
Syed, Mohammed Zishan Ali Singapore, SG 5 0

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