Solder mask design for delamination prevention

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11476174
APP PUB NO 20200135602A1
SERIAL NO

16177046

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments described herein provide techniques for forming a solder mask having a repeating pattern of features formed therein. The repeating pattern of features can be conceptually understood as a plurality of groove structures formed in the solder mask. The solder mask can be included in a semiconductor package that comprises the solder mask over a substrate and a molding compound over the solder mask that conforms to the repeating pattern of features. Several advantages are attributable to embodiments of the solder mask described herein. One advantage is that the repeating pattern of features formed in the solder mask increase the contact area between the solder mask and the molding compound. Increasing the contact area can assist with increasing adherence and conformance of the molding compound to the solder mask. This increased adherence and conformance assists with minimizing or eliminating interfacial delamination.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Yuhong Folsom, US 15 38
Xu, Yi Folsom, US 278 1996
Zhang, James Folsom, US 65 1048

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