Mold for injection molding of disc substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 19, 2005
Grant Date -
Oct 4, 2001
app pub date -
Mar 19, 2001
filing date -
Mar 24, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conduction member having conduction path for injecting molten molding material within a mold space is fitted to one of a pair of mold bodies which form the disc-shaped mold space. A first heat suppressing member for suppressing heat within the conduction path from being transmitted to the one of the mold bodies is disposed between the conduction member and the one of the mold bodies. Further, a second heat suppressing member is disposed at a position opposite to the first heat suppressing member at the time of mold-clamping the pair of the mold bodies.
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