Method of structuring a credit having a repayment obligation
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United States of America Patent
Stats
-
Feb 15, 2011
Grant Date -
N/A
app pub date -
Mar 30, 2001
filing date -
Dec 15, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In one embodiment a method of structuring a credit having a repayment obligation is provided, including: setting an expected maturity date and a final maturity date for the credit; requiring that the repayment obligation be met by the expected maturity date unless at least one predefined event occurs; and requiring that the repayment obligation be met by the final maturity date to the extent that the repayment obligation is not met by the expected maturity date. In another embodiment a method of structuring a bond issued by a bond issuer, wherein the bond has associated therewith a repayment obligation, is provided, including: setting an expected payment date and a legal maturity date for the bond; requiring that the bond issuer establish revenue rates sufficient to pay the repayment obligation by the expected payment date; and deferring the payment of the repayment obligation as late as the legal maturity date to the extent that the repayment obligation is not met by the expected payment date.
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