Semiconductor devices and methods of manufacture thereof
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United States of America Patent
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Dec 8, 2015
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N/A
app pub date -
Aug 1, 2007
filing date -
Aug 1, 2007
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Abstract
Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes providing a semiconductor wafer, forming a gate dielectric over the semiconductor wafer, and forming a gate over the gate dielectric. At least one recess is formed in the semiconductor wafer proximate the gate and the gate dielectric, at least a portion of the at least one recess extending beneath the gate. The at least one recess in the semiconductor wafer is filled with a semiconductive material.
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