Electroless gold plating bath, electroless gold plating method and electronic parts
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United States of America Patent
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Aug 2, 2011
Grant Date -
Jun 12, 2008
app pub date -
Dec 5, 2007
filing date -
Dec 6, 2006
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Abstract
, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
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