Semiconductor wafer arrangement of a semiconductor wafer
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United States of America Patent
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Mar 16, 2004
Issued Date -
N/A
app pub date -
Dec 16, 2002
filing date -
Aug 30, 2001
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Abstract
A method of processing a semiconductor wafer and an associated semiconductor wafer arrangement which inhibits 'punch through' and increases the yield of functional semiconductor wafers during the fabrication thereof is disclosed.
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