Sensor package cavities with polymer films

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United States of America Patent

PATENT NO 11476175
SERIAL NO

17125487

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Abstract

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In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

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Patent Owner(s)

  • TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koduri, Sreenivasan Kalyani Allen, US 27 17
Stark, Leslie Edward Heath, US 14 29

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