Stacking integrated circuits containing serializer and deserializer blocks using through

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United States of America Patent

PATENT NO 11894342
APP PUB NO 20210035955A1
SERIAL NO

17076207

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Abstract

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Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.

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Patent Owner(s)

  • BROADPAK CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yazdani, Farhang Santa Clara, US 24 760

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