Contactless communication medium
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United States of America Patent
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-
Jul 31, 2012
Grant Date -
Jul 14, 2011
app pub date -
Mar 23, 2011
filing date -
Aug 26, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.
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