Insulating material for wiring substrate and method of producing multi-layered wiring substrate
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United States of America Patent
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Sep 20, 1994
Issued Date -
N/A
app pub date -
Jan 15, 1993
filing date -
Jan 17, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.
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