System and method of manufacture for interconnecting an integrated circuit and a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 23, 2010
Issued Date -
N/A
app pub date -
Apr 9, 2007
filing date -
Apr 9, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit/substrate interconnect apparatus and method of manufacture are provided. Included is a substrate with a plurality of wells and a landing pad formed in each of the wells. The substrate further includes a seed layer deposited in each of the wells over the landing pad, and a metalized layer deposited in each of the wells over the seed layer. Before assembly, an upper surface of the metalized layer forms a well.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully