Architecture for chip-to-chip interconnection in semiconductors

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United States of America Patent

PATENT NO 11546984
SERIAL NO

17530449

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Abstract

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A PCB bridge for interconnection of two or more semiconductor chips for data communication between the semiconductor chips includes a plurality of metal strips; and a dielectric material disposed in between the plurality of metal strips. The PCB bridge is employed in a vertical direction in a semiconductor module for interconnection of two or more semiconductor chips, the vertical direction of the PCB bridge provides a flexible impedance matching by adjusting the dielectric material and a trace width of the PCB bridge, and the vertical direction of the PCB bridge avoids signal reflections by matching the impedance to a source, and a trace length of the PCB bridge is limited by spacing in between two semiconductor chips which further limited inductance of the trace of the PCB bridge.

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Patent Owner(s)

  • CLOUD LIGHT TECHNOLOGY LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wong, Ka Kit Hong Kong, HK 3 7

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