Via shielding for power/ground layers on printed circuit board
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United States of America Patent
Stats
-
Sep 18, 2007
Grant Date -
Dec 2, 2004
app pub date -
Jul 8, 2004
filing date -
Sep 4, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
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