Semiconductor device suitable for testing
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United States of America Patent
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May 18, 1999
Issued Date -
N/A
app pub date -
Apr 10, 1998
filing date -
Jul 7, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a rigid member embedded in a resin package body for supporting thereon outer leads that extend from the resin package body and test pads provided on the outer leads for testing the semiconductor device.
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