Semiconductor device using low-K material as interlayer insulating film and its manufacture method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 14, 2007
Grant Date -
Nov 10, 2005
app pub date -
Jul 13, 2005
filing date -
Aug 2, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor element is formed over a surface of a semiconductor substrate. A first insulating film is formed over the surface of the semiconductor substrate, the first insulating film covering the semiconductor element. A second insulating film is formed over the first insulating film, the second insulating film having a dielectric constant lower than that of the first insulating film. A first wiring pattern is formed over the second insulating film. A conductive connection member buried in the second and first insulating films electrically interconnects the first wiring pattern and semiconductor element.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully