Camera module including heat dissipating structure and electronic device including the same
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United States of America Patent
Stats
-
Jul 12, 2022
Grant Date -
Oct 8, 2020
app pub date -
Apr 3, 2020
filing date -
Apr 4, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.
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