Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking

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United States of America Patent

PATENT NO 11862497
APP PUB NO 20210351053A1
SERIAL NO

17381297

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Abstract

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A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Devilliers, Anton J Clifton Park, US 150 890
Fulford, H Jim Albany, US 232 1643
Schepis, Anthony Albany, US 8 13

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