Hybrid bonding with uniform pattern density
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United States of America Patent
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Mar 29, 2016
Grant Date -
Oct 1, 2015
app pub date -
Mar 28, 2014
filing date -
Mar 28, 2014
priority date (Note) -
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Abstract
A chip includes a semiconductor substrate, integrated circuits with at least portions in the semiconductor substrate, and a surface dielectric layer over the integrated circuits. A plurality of metal pads is distributed substantially uniformly throughout substantially an entirety of a surface of the chip. The plurality of metal pads has top surfaces level with a top surface of the surface dielectric layer. The plurality of metal pads includes active metal pads and dummy metal pads. The active metal pads are electrically coupled to the integrated circuits. The dummy metal pads are electrically decoupled from the integrated circuits.
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