Thermopile infrared sensor array

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United States of America Patent

PATENT NO 7842922
SERIAL NO

11913443

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.

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Patent Owner(s)

  • HEIMANN SENSOR GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leneke, Wilhelm Dresden, DE 14 100
Schieferdecker, Joerg Dresden, DE 4 95
Schulze, Mischa Meissen, DE 7 85
Simon, Marion Bad Schwalbach, DE 15 133
Storck, Karlheinz Pesterwitz, DE 18 230

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