Finishing method for producing thin-laminate panels
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United States of America Patent
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Sep 14, 2004
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N/A
app pub date -
Feb 14, 2000
filing date -
Oct 13, 1998
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Abstract
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. Finishing methods for treating unfinished thin-laminate panels into finished thin-laminate panels assure that the edges of the dielectric layer of the panel are substantially free of conductive material.
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