Liner-free conductive structures with anchor points

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United States of America Patent

PATENT NO 11837544
APP PUB NO 20230016100A1
SERIAL NO

17815730

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Abstract

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The present disclosure describes a method for forming liner-free or barrier-free conductive structures. The method includes depositing an etch stop layer on a cobalt contact disposed on a substrate, depositing a dielectric on the etch stop layer, etching the dielectric and the etch stop layer to form an opening that exposes a top surface of the cobalt contact, and etching the exposed top surface of the cobalt contact to form a recess in the cobalt contact extending laterally under the etch stop layer. The method further includes depositing a ruthenium metal to substantially fill the recess and the opening, and annealing the ruthenium metal to form an oxide layer between the ruthenium metal and the dielectric.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Hsu-Kai Hsinchu, TW 41 63
Chu, Chia-Hung Taipei, TW 70 109
Liang, Shuen-Shin Hsinchu, TW 65 36
Lin, Keng-Chu Hsinchu, TW 180 632
Wang, Sung-Li Zhubei, TW 124 2868

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