Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam
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United States of America Patent
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Aug 3, 2004
Grant Date -
Dec 26, 2002
app pub date -
Jun 21, 2002
filing date -
Jun 21, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.
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